What Will Intel Do Next?
The writing is on the wall for big processor makers. Apple, Amazon, Facebook and Google are developing their own processors. In addition, there are more than 30 startups developing various types of AI...
View ArticleThermal Guard-Banding
Stephen Crosher, CEO of Moortec, talks with Semiconductor Engineering about the impact of more accurate measurements on power, performance and reliability of designs from 40nm all the way down to 3nm.
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China’s Foundry Biz Takes Big Leap Forward
China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world,...
View ArticleRealizing the Benefits of 14/16nm Technologies
The scaling benefits of Moore’s Law are challenging below 28nm. It is no longer a given that the cost per gate will go down at process nodes below 28nm, e.g., 20nm though 14nm and 7nm. Rising design...
View ArticleInfluence Of SiGe On Parasitic Parameters in PMOS
In this paper, simulation-based design-technology co-optimization (DTCO) is carried out using the Coventor SEMulator3D virtual fabrication platform with its integrated electrical analysis capabilities...
View ArticleWeek In Review: Manufacturing, Test
Fab tools Citing the outbreak of the coronavirus in China, SEMI has postponed Semicon/FPD China 2020 and related events originally scheduled for March 18-20, 2020. For the same reason, SEMI will no...
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China Speeds Up Advanced Chip Development
China is accelerating its efforts to advance its domestic semiconductor industry, amid ongoing trade tensions with the West, in hopes of becoming more self-sufficient. The country is still behind in IC...
View ArticleIntel/GF deal: Pros, Cons, Unknowns
The industry is still buzzing over a Wall Street Journal report that Intel is in talks to acquire GlobalFoundries (GF) for $30 billion. It’s been a week since the report appeared. Intel is still mum....
View ArticleProcess Variation Analysis Of Device Performance Using Virtual Fabrication —...
A new methodology is demonstrated to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. A model of a FinFET device was built...
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Screening For Silent Data Errors
Engineers are beginning to understand the causes of silent data errors (SDEs) and the data center failures they cause, both of which can be reduced by increasing test coverage and boosting inspection...
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